Taiwan's top OSAT company ASE Technology Holding has been stepping up its purchases of more automated wire-bonding packaging machines to expand capacity for clients, while also enhancing its smart ...

SANTA CLARA, Calif. — Chip-packaging giant Advanced Semiconductor Engineering Inc. (ASE) today unveiled a new wire bonding technique that reduces the die size but increases I/O for complex chips.

Advanced Semiconductor Engineering Inc. (ASE) today announced that it has worked with Taiwan Semiconductor Manufacturing Co. Ltd. to qualify ASE's wire bond BGA and flip chip BGA for use with TSMC's ...

TAIPEI, Taiwan--(BUSINESS WIRE)--Jason Chang, chairman of Advanced Semiconductor Engineering, Inc. (TAIEX: 2311, NYSE: ASX) has formally received the SEMI award at the 2015 SEMICON Taiwan Leadership ...

Delivery lead times for IC packaging and testing machines have shortened notably amid weakening demand and improving supply of basic ICs used in the machines, according to industry... China-based ...

This ball-bonder type wire-bonding machine makes delicate welds at breakneck speeds. It requires many of the same stage and controller capabilities as automated IC programmers, PCB assemblers, FPD and ...