In the manufacturing world, the word “retrofit” many times is feared to mean “lost production.” In other words, plants—or at least parts of plants—must be shut down for equipment to be upgraded. And ...

Advanced packaging is transforming semiconductor manufacturing into a multi-dimensional challenge, blending 2D front-end wafer fabrication with 2.5D/3D assemblies, high-frequency device ...

Metrology and inspection are dealing with a slew of issues tied to 3D measurements, buried defects, and higher sensitivity as device features continue to shrink to 2nm and below. This is made even ...

Designed with ease of use in mind, the software modernizes the graphical user interface while retaining the rigorous and robust calculation engine from the company's Connoisseur APC (Advanced Process ...