Today’s fan-out wafer-level packaging (FOWLP) processes use organic substrates composed of epoxy mold compound (EMC) created using a thermal compression process. EMC wafers are a cost-effective way to ...
Predominantly, if the metal part used in compression molding is tension or compression loaded, a ratio of metal part thickness to its extensional modulus, multiplied by the Bulk Molding Compound (BMC) ...
Customers can now access more capabilities and capacity for expanded production methods, simplifying custom mechanical sourcing. SAN FRANCISCO, Jan. 17, 2024 /PRNewswire/ -- Fictiv, a global ...
System-in-Package (SiP) technology has been used for a wide range of electronic devices, but the warpage behavior of the package can be difficult to control and predict due to complex manufacturing ...
As automotive engineers continue to search for ways to make lighter, less-costly components, the compression molding of composites has taken center stage in composites-for-metal substitution. Unlike ...
The hybrid-composite rear load floor uses unidirectional (UD) thermoplastic tapes plus direct-long-fiber thermoplastic (D-LFT) composites. Thermoplastic tapes provided high stiffness/strength in a ...
B A Die Mold Inc. is observing its 55th anniversary this year. The Aurora, Ill.-based company makes molds for customers in the water filtration, health care, appliance controls, caps and closures, and ...