Apple is gearing up to use TSMC's latest SoIC advanced packaging technologies for its next-generation M5 chips as part of a two-pronged strategy for the company to power its future Macs and AI servers ...

Honeycomb paper is reshaping packaging and construction by offering a lightweight, strong, and eco-friendly alternative to ...

Shows Michelman's commitment to sustainable packaging and its successful collaboration with BOBST and UPM Specialty Papers in the oneBARRIER FibreCycle project. Michelman will continue pushing ...

SiPearl, a CPU developer funded by the EU, this week introduced its Ahena1, Europe's first high-performance processor with up to 80 cores designed for both civilian and military use. The CPU relies on ...

Imagine drones that map disaster zones today and scout military targets tomorrow. Or seismic activity sensors built for construction that go on to detect submarines underwater. These ideas represent ...

The term “dual-use” is something of a lightning rod in the startup world, sparking debates about its meaning and usefulness. In these virtual pages, Jake Chapman wrote that “reliance on dual-use ...

TL;DR: Apple has ordered next-gen M5 chips from TSMC for iPad Pro and Macs, with production in 2H 2025. The M5 chips will use TSMC's 3nm process and SoIC technology for better thermal management, with ...

The age of AI greatly boosts Semiconductor manufacturing demands in advanced packaging. As packaging complexity increases (more I/O, smaller bump pitches, higher density), making the integration of ...

Supply chains are tested daily for stability, from facing potential pandemic-style disruption to geopolitical volatility. They must be able to support critical assets; in defense, this includes lives.

October 03, 2025 - The term "dual-use technology" refers to innovation with both civilian and military applications. For decades, the epicenter of this innovation was unmistakably American. From DARPA ...