In an era of collapsing economies, waning affluence, and too much garbage amid scarcity, a characteristic that is part of the engineering character – resourcefulness – is due to come back in vogue, as ...

PISCATAWAY, N.J.--(BUSINESS WIRE)--IEEE, the world's largest technical professional organization dedicated to advancing technology for humanity, today announced that abstracts and proposals for ...

Moulded fibre packaging is a sustainable, versatile, and affordable alternative to plastic that protects products across ...

A new design paradigm combines mechanical, electrical, thermal, and optical aspects in an integrated system concept.

Printed Electronics is key in enabling smart packaging innovations, a fast growing market for industry, researchers say. The smart packaging market is expected to grow to more than US$ 1.45 billion in ...

PISCATAWAY, N.J.--(BUSINESS WIRE)--IEEE, the world's largest technical professional organization dedicated to advancing technology for humanity, and the IEEE Electronics Packaging Society (EPS) today ...

LG Electronics is aggressively entering the advanced semiconductor packaging equipment market to meet the surging demand ...

"This new group integrates KLA's acquisition of the Orbotech and SPTS business to bring complementary technologies, products and services into one organization to drive innovation and results in ...

The Japan Industrial Electronics Packaging Market is poised for significant growth, projected to increase from USD 102.8 million in 2023 to USD 138.8 million in 2032. Calculated at a steady compound ...

Demands for lower-cost, higher-density, and smaller-footprint ICs aimed at portable electronics make 3D-packaging designers sweat. The push for 3D packaging of semiconductor ICs directly results from ...

Electronic Vehicles (EVs) have been at the center of attention in recent years. With the automotive industry becoming more aligned with sustainable development goals, the focus has shifted toward EVs ...