Kyocera’s ceramic packaging based on HTCC technology (High Temperature Co-Fired Ceramics), which is currently used with specific “non-magnetic” piece parts and plating options, is now being used to ...

Upsurging HTCC Ceramic Substrates demand, product awareness, raw material affluence, market stability, increasing disposable incomes, and favorable financial status are owing to uplift the market ...

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Providing military and aerospace electronics design engineers with the capability to integrate ultra-precision resistor networks into high reliability circuits for harsh environments, TT electronics ...