Nowadays, there are many interconnects in IC chips. One of the packaging goals is to connect an IC to the next level of subsystem circuitry (package substrates/print circuit boards). Mass reflow (MR) ...
The Optimization, Data, and Decision Science (ODDS) Lab, established in late 2023 under the leadership of Dr. Ilgin Acar, represents a dynamic hub for cutting-edge research at the intersection of ...
Virtual labs have proven to be very versatile and valuable for providing realistic experience for students in STE (Science, Technology, and Engineering) fields. As we progress from delivery of ...
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