Combined, laminate substrates and leadframes will represent an estimated US$ 13.3 billion market in 2011 and is forecasted to reach $14 billion in 2012. This is larger than the revenues for silicon ...

According to new research study on “Substrate-Like-PCB Market,” the report delivers comprehensive insights into the market’s size, share, trends, and analysis. It encompasses a wealth of information ...

US & Canada, March 24, 2025 (GLOBE NEWSWIRE) -- According to a new comprehensive report from The Insight Partners, "Substrate-Like PCB Market Size and Forecast (2021 - 2031), Global and Regional Share ...

The substrate-like PCB market is growing with the increasing acceptance of these components among OEMs, smart consumer electronics, and wearable devices. The market for these PCBs is also growing due ...

The rise of artificial intelligence (AI) and the new energy / autonomous vehicle industry presents both challenges and exciting opportunities for the printed circuit board (PCB) and packaging ...

As Moore's Law nears its physical and commercial limits, advanced packaging has become the new battleground defining the evolution of IC substrate technology and the global PCB landscape. Henry ...

Fueled by booming demand for advanced packaging like CoWoS, a new report from China’s Wallstreetcn is turning heads with claims of a breakthrough “CoWoP” (Chip on Wafer on PCB) tech—mounting chips ...

Embedded die packaging is seeing renewed demand amid the push towards chips and systems that require smaller form factors. ASE, AT&S, GE, Shinko, Taiyo Yuden, TDK, Würth Elektronik and others compete ...

The power electronics industry and the semiconductor industry, inseparably intertwined with one another, are facing unprecedented efficiency, cost, construction and thermal challenges which provide ...

More power in the same footprint is the constant request of the power industry’s customers. This challenge has hit a fever pitch as digital semiconductor packaging technology has increased performance ...