This year’s top semiconductor stories were mostly about the long and twisting trips a technology takes from idea (or even raw ...
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MIT finds a new way to pack more transistors on a chip
For decades, chipmakers have squeezed more computing power out of silicon by shrinking transistors, but that strategy is running into hard physical limits. A new approach from MIT aims to sidestep ...
The advanced semiconductor material gallium nitride will likely be key for the next generation of high-speed communication systems and the power electronics needed for state-of-the-art data centers.
(Nanowerk News) Microchip fab plants in the United States can cram billions of data processing transistors onto a tiny silicon chip, but a critical device, in essence a “clock,” to time the operation ...
A new Germany-based startup, Semron, is developing what it describes as "3D-scaled" chips to run AI models locally on smartphones, earbuds, VR headsets and other mobile devices. Co-created by Kai-Uwe ...
Samsung, the world's largest memory chipmaker, and SK Hynix, the second-largest, rely heavily on China as a manufacturing ...
Computer researchers have fashioned infinitesimally tiny electronic switches using conventional chipmaking equipment, demonstrating that the semiconductor industry will be able to continue shrinking ...
Stanford, CMU, Penn, MIT, and SkyWater Technology reached a major milestone by producing the first monolithic 3D chip ...
A new technique uses standard chip fab methods to fabricate the building block of a timing device, critical to all microprocessors. Currently, this timing device, known as an acoustic resonator, must ...
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