A new technical paper titled “Design and Implementation of Test Infrastructure for Higher Parallel Wafer Level Testing of System-on-Chip” was published by researchers at Inha University and Teradyne. ...
Wafer inspection has become a critical part of the semiconductor manufacturing process. Inspections performed after wafer test can analyze the marks left by probe cards to ensure that the test process ...
Final electrical test remains one of the best ways to assess a circuit’s ultimate viability. But we know that, unfortunately, even 100% end-of-line electrical testing of semiconductor wafers will not ...
Keeping an IC cool takes on new meaning when power dissipation exceeds 150 watts. Innovative electrical and mechanical solutions to new wafer testing challenges continue to be developed. For example, ...
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