The new controller enables PI to keep pace with future advancements and customer needs in photonics and optical testing.
(Nanowerk News) PI's new F-141 photonics alignment system provides high throughput with motion in 4 and 6 degrees of freedom for industrial test and assembly of photonic integrated circuits (PIC).
Photonic integrated circuits (PICs) are compact devices that combine multiple optical components on a single chip. They have a wide range of applications in communications, ranging, sensing, computing ...
The precision required poses several challenges for testing and packaging procedures, necessitating the precise alignment of fiber optic devices in high-throughput production settings. PI offers ...
Photonic integrated circuits (PIC) are on the verge of significant disruption through the unlocking of novel applications. This success largely relies on advanced wafer-level miniaturized photonic ...
Commercialization has started for network switches based on co-packaged optics (CPO), which are capable of routing signals at terabits per second speeds, but manufacturing challenges remain regarding ...
A major focus at this year’s OFC will be on the emerging photonic technologies required to enable large-scale generative AI networks. Optical interconnects based on ...
A technical paper titled “Engineered scattering elements used as optical test points in photonic integrated circuits” was published by researchers at University of Rochester. “Efficient packaging of ...
OpenLight Announces Sample Availability of its First 1.6Tb DR8 DFB-based Photonic Integrated Circuit
Technology alleviates system complexity and cost pressures and is capable of handling 1.6Tb data rates at 200G per lane, making it ideal for datacenter networking and AI applications SANTA CLARA, ...
PI's latest 6-axis alignment system is available in one-sided and double-sided configurations, upright for PIC assembly or ...
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