QFN bad soldering is often happening in SMT assemble, consider from many aspects, such as pad design, PCB storage, chip control and management, solder paste management and use, furnace temperature ...
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SHENMAO Develops Lead-Free Solder Paste PF606-P for Innovative “Reverse Hybrid” Process
SHENMAO America, Inc. is excited to introduce its Lead-Free Solder Paste PF606-P, designed specifically for the “Reverse Hybrid” assembly process. This new approach is revolutionizing board assembly ...
The cost of manufacturing printed circuit board assemblies (PCBAs) has always been a concern for original equipment manufacturers (OEM) and contract manufacturers (CM). This is one of the reasons why ...
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