NINGBO, China, Jan. 15, 2024 /PRNewswire/ -- The photovoltaic industry, as a technology-driven sector, has undergone multiple rounds of technological iterations under the unchanging underlying ...

Modern chips are manufactured on slabs of silicon less than a millimeter thick. But semiconductor companies try to slice these silicon wafers thinner and thinner to squeeze more performance out of ...

South Korean researchers have developed a process to produce ultra-thin wafers without sacrificing any of the substrates. Their technique is based on a new approach involving the use of ...

While much of the focus on the impending move to 450mm has focused on the equipment challenges, the wafers themselves are of course the primordial consideration. Predictions are starting to mount up ...

Hongyuan Green Energy said it has produced a first batch of 40 µm ultra-thin monocrystalline silicon wafers at its smart wafer manufacturing base in Baotou, China, marking what it describes as a ...

Ibis Technology Corp. today announced it has started shipping its Advantox MLD-UT wafers that offer an ultra-thin silicon layer as thin as 300-angstroms. According to the Danvers, Mass.-based company, ...

The elimination of sawing kerf loss combined with its ability to make thinner wafers of high quality make the implant-cleave wafering approach technically and economically attractive. For example, ...

FREMONT, Calif., Sept. 15, 2020 (GLOBE NEWSWIRE) -- ACM Research, Inc. (NASDAQ: ACMR), a leading supplier of wafer-processing solutions for semiconductor and advanced wafer-level packaging (WLP) ...

(MENAFN- GlobeNewsWire - Nasdaq) With the rising adoption of miniaturized consumer electronic devices and ongoing progress in semiconductor technology, thin wafer production, appears to have a ...

A new way to make ultra-thin diamond wafers using sticky tape could help produce diamond-based electronics, which might one day be a useful alternative to silicon-based designs. Diamond has unusual ...