Rapidus on Friday announced that it had begun prototyping of test wafers with 2nm gate-all-around (GAA) transistor structures at its IIM-1 facility in Japan. The company confirmed that early test ...
Extensive Array of Back-End and Advanced Packaging Wet Wafer Process Equipment Leverages ACM’s Experience to Address Emerging Requirements for Wafer-Level Packaging FREMONT, Calif., Oct. 15, 2020 ...
A technical paper titled “Review of virtual wafer process modeling and metrology for advanced technology development” was published by researchers at Coventor Inc., Lam Research. “Semiconductor logic ...
This higher density of circuitry on a wafer requires greater accuracy and a highly fragile and advanced fabrication process. Several newer and highly complex ICs today are made of a dozen or more ...
ACM’s Ultra C VI Tool Supports Most Semiconductor Clean Processes for Advanced Logic, DRAM and 3D NAND Manufacturing; Provides 50% More Throughput Than 12 Chamber Tool FREMONT, Calif., April 21, 2022 ...
Semiconductors guarantee high resistance, low cost, and reliability when used in electronic circuits. To manufacture semiconductor devices, multiple photographic and chemical-processing steps are ...
In this interview, Dr. Chady Stephan, PhD, the Applied Markets Leader at PerkinElmer, talks to AZoM about the current trends shaping semiconductor wafer manufacturing. A semiconductor is a material ...
Asymmetries in wafer map defects are usually treated as random production hardware defects. For example, asymmetric wafer defects can be caused by particles inadvertently deposited on a wafer during ...
AUSTIN, Texas — The Advanced Technology Development Facility Inc. (ATDF), an independent subsidiary of the Sematech consortium of nine chip companies, is planning to process approximately five ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results
Feedback