Comparing die test results with other die on a wafer helps identify outliers, but combining that data with the exact location of an outlier offers a much deeper understanding of what can go wrong and ...

Advanced machine learning is beginning to make inroads into yield enhancement methodology as fabs and equipment makers seek to identify defectivity patterns in wafer images with greater accuracy and ...

Test strategy analysis has become increasingly important for finding ways to reduce test costs for system-on-a-chip (SoC) semiconductor devices. Every SoC device’s test flow is unique and requires a ...