CLAYTON COUNTY, Ga. — The Clayton County School District is moving forward with plans to rebuild North Clayton High School. In a recent Clayton County Board of Education meeting, board members ...

Through this partnership, Aptech Ltd. and WOL3D remain committed to building a strong foundation of 3D printing & product design education in India, combining creative expertise with technical ...

Experts at the Table: Semiconductor Engineering sat down to discuss 3D-IC design challenges and the impact on stacked die on EDA tools and methodologies, with John Ferguson, senior director of product ...

A handgun built from a 3-D printer was found in a vehicle at Concord High School on Thursday afternoon, according to police. Police said they responded around 12:15 p.m. Thursday for a report of a ...

JEFFERSON DAVIS COUNTY, Miss. (WDAM) - Students are getting a close-up look at some brand new high-tech equipment being used at Jefferson Davis County High School. New 3D-printers, robotics kits, and ...

Year 7 students have 3D-printed a hand as part of a school project for their friend and peer, Lois Agnello. The open-source design for Lois's hand was provided by Australian-based charity Free 3D ...

The general public got a look at Newark’s newest high school on Wednesday, a former hospital meant to prep students for careers in architecture, design, and the building trades in a city undergoing a ...

The Memphis Flyer is Memphis’ alternative newsweekly, serving the metro Memphis area of nearly a million residents. The Flyer was started in 1989 by Contemporary Media, Inc., the locally owned ...

Ansys HFSS-IC Pro™ platform is certified for system-on-chip electromagnetic extraction with TSMC's N5 and N3P process technologies Ansys RedHawk-SC™ and Ansys Totem™ power integrity platforms are ...

Integration enables seamless fleet management of Bambu printers through trusted Polar Cloud platform used in 6,800+ schools. Polar3D, creator of the Polar Cloud platform used in thousands of schools ...

3D IC chiplet-based heterogeneous package integration represents the next major evolution in semiconductor design. It allows us to continue scaling system performance despite the physical limitationA ...