Experts at the Table: Semiconductor Engineering sat down to discuss initial forays into 3D-ICs and what problems early adopters will encounter, with John Ferguson, senior director of product ...

Ansys HFSS-IC Pro™ platform is certified for system-on-chip electromagnetic extraction with TSMC's N5 and N3P process technologies Ansys RedHawk-SC™ and Ansys Totem™ power integrity platforms are ...

Abstract: A 2D subspace optimization-based inverse design method (SO-IDM) is proposed for planar multilayer printed circuit-type antenna superstrate to achieve a desired stable shaped beam pattern, ...

Since their discovery at Drexel University in 2011, MXenes — a family of nanomaterials with unique properties of durability, conductivity and filtration, among many others — has become the largest ...

Nanoleaf this week announced the launch of the 4D V2, a product that's designed to provide ambient lighting that matches the colors on your TV set. The second version of the Screen Mirror and ...

The chassis incorporates an extended side‑mesh panel that supports standard ATX power supplies up to 200 mm in length without increasing external width. Its 10° inclined base plate directs cool air ...

The mechanical strength and toughness of engineering materials are often mutually exclusive, posing challenges for material design and selection. To address this, a research team from The Hong Kong ...

The AI-driven framework of optimizing the mechanical property of 2D-PHS. Two-dimensional patterned hollow structures (2D-PHS) are an advanced class of metamaterials known for their unique mechanical ...

Angelina Jolie planning to sell LA home and move abroad after Brad Pitt custody restrictions lift: report Dad Dies From Flesh-Eating Bacteria After Scratching His Leg on Boat Trailer in Front of His ...